Chinese Government Scholarship-High-level Postgraduate Program is a full scholarship established by the Ministry of Education, P.R.C. to support designated Chinese universities to enroll outstanding international students for postgraduate studies in China.
The Chinese Government Scholarship “High-Level Postgraduate” program is a full scholarship provided by the Ministry of Education of China to some high-level universities in China. It is used by universities to select and recruit outstanding young foreign students to pursue postgraduate degrees in China.
Benefits
Full Tuition Coverage: No fees for your academic program.
Accommodation: Free housing in the university dormitory or a housing allowance.
Monthly Stipend:
Master’s students: CNY 3,000/month
Doctoral students: CNY 3,500/month
Comprehensive Medical Insurance: Covers all major medical expenses.
Requirements
Be a citizen of a country other than the PRC and in good health both mentally and physically;
Be an academically excellent holder of a bachelor’s degree under the age of 35 when applying for a master’s program;
Be an academically excellent holder of a master’s degree under the age of 40 when applying for a doctoral program;
Have passed the HSK (Level 4) when applying for a Chinese-taught postgraduate program;
Have TOEFL 90+ or IELTS 6.5+ when applying for an English-taught postgraduate program ( for non-native English speakers);
Meet the university’s admission requirements in terms of academic ability and other relevant criteria.
Application Documents
Application Form
Copy of Passport Home Page
Notarized the highest diploma
Academic transcripts (from the undergraduate program onwards).
Language qualification certificates
A study plan proposal
Recommendation letters
A photocopy of the Foreigner Physical Examination Form completed in English
Non-criminal record report
Provisional acceptance letter issued by CPU professors (download the form: http://international.cpu.edu.cn/366/list.htm)
Method of Application
For More Information,
Visit the Official Webpage
Application Deadline: February 20, 2025.