The Mohamed bin Zayed University of Artificial Intelligence (MBZUAI) in the United Arab Emirates (UAE) is inviting applications for its 2026 AI Undergraduate Research Internship Program (UGRIP).
The UAE Undergraduate Research Internship Program (UGRIP) is a fully funded opportunity that covers monthly stipends, visa, airfares, airport transfers, accommodation, health insurance, and access to MBZUAI’s student facilities.
Eligibility Requirements
To be considered for the UAE Undergraduate Research Internship, you must:
Undergraduate students in the penultimate year of a STEM-related major and graduating after August 2026
Minimum CGPA of 3.5 (on a 4.0 scale) or equivalent
Benefits
The UAE Undergraduate Research Internship Program (UGRIP) offers the following benefits;
A generous stipend
Accommodation
Visa, airfares, and airport transfers
Health insurance
Social and cultural activities
Access to MBZUAI’s student facilities
Required Documents
To apply, candidates must be ready to submit the following documents;
Application Form
Enrollment letter from the University registrar showing admission date, program duration, and expected graduation date
Official academic transcript listing all courses, grades, and credit hours
Proof of English proficiency through a valid certificate of any of the following:
TOEFL iBT with a minimum total score of 90
IELTS Academic with a minimum overall score of 6.5
EmSAT English with a minimum score of 1550
OR official letter from University registrar confirming English is the medium of instruction
Valid color passport copy (minimum one year validity)
Statement of purpose essay, including:
Motivation for applying
Personal and academic background and how it makes you suitable for the UGRIP
Stand-out achievements (e.g., awards, distinction, etc.)
Goals as a prospective UGRIP participant
Preferred career path and plans
Any other relevant details that will support the application.
All documents must be in English or include certified translations. Academic documents must carry official stamps and signatures.
Method of Application
Click Here to Apply
Application Deadline: February 28, 2026.